Selective soldering is an automated PCB assembly process that applies flux, heat, and molten solder only to designated through-hole joints. It is commonly used on
Wave soldering is a mass-soldering process in which a fluxed and preheated printed circuit board assembly passes over a controlled wave of molten solder. It
A QFN package, or quad flat no-lead package, is a low-profile surface-mount IC package with flat electrical terminals around its underside perimeter. Many QFNs also
A PCB pad is an exposed conductive area used to solder, connect, test, or thermally couple a component to a printed circuit board. Its final
PCB thickness is the distance between the two outer faces of a manufactured printed circuit board. A rigid FR-4 PCB often starts at a nominal
Flex PCB assembly troubleshooting should begin by preserving the failed condition and locating the first process stage where the defect appeared. Separate possible causes into
A surface mount device (SMD) is an electronic component soldered directly onto pads on a printed circuit board. A phone or medical monitor may carry
Ceramic PCB and FR4 are main substrate on market. FR4 is the standard substrate for most commercial electronics because it is affordable, scalable, and easy
SMT defects in PCB assembly can short a circuit, interrupt a signal path, or weaken a joint that later fails in service. A board may
HDI PCB design becomes necessary when conventional routing can no longer meet density, size, or signal-integrity requirements. HDI PCB is common in compact medical devices,
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