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Rogers PCB
Rogers PCB is used in the high-frequency and high-speed electronic industry where signal integrity, thermal stability, and low dielectric loss are critical.
PCBSAIL specializes in manufacturing high-performance Rogers PCBS using advanced materials from Rogers Corporation. It can ensure consistent electrical performance across demanding environments.
Whether you are developing RF systems, 5G infrastructure, automotive radar, or aerospace electronics, our Rogers PCB can deliver precision, reliability, and scalability.
Rogers PCB Manufacturer.
We are a professional Rogers PCB manufacturer for RF, microwave, and high-speed digital systems.
With years of manufacturing experience and a strong engineering foundation, we deliver precision-built circuit boards that meet the demanding requirements of modern electronics.
Our production facilities are equipped with advanced fabrication lines, high-accuracy testing systems, and strict quality control processes. It can make us to offer Rogers PCB from rapid prototyping to full-scale mass production.
By combining advanced materials from Rogers Corporation with precision manufacturing processes, we help customers get optimal signal integrity and long-term reliability Rogers PCBs.
Manufacturing Capacity
We can support complex RF and high-frequency circuit designs.
- Layer Count: 1 to 64 layers
- Multilayer RF stackups and hybrid constructions
- Optimized for mixed-signal (RF + digital) designs
- Minimum Trace/Spacing: 1.8 mil / 1.8 mil
- Minimum Hole Size: 0.15 mm
- Laser Microvias: 3 mil (HDI capability)
- Supports blind vias, buried vias, and via-in-pad
Engineering Support
Our engineering team provides full support for your project lifecycle:
- Stackup design and material selection
- Impedance modeling and simulation
- Dk/Df matching for signal layers
- DFM review
Quality Assurance
Every Rogers PCB undergoes strict inspection and validation:
- AOI
- X-ray inspection for via integrity
- Impedance testing
- Electrical testing
- Microsection analysis
Feature Rogers PCB.
We can provide a full range of Rogers PCBs. By leveraging advanced laminates from Rogers Corporation, we deliver circuit boards with low dielectric loss, stable impedance, and superior thermal reliability.
Rogers PCB We Offer.
Single-Layer Rogers PCB
Single-layer Rogers PCBs are built with one conductive layer on a high-frequency substrate, making them a cost-effective solution for simple RF circuits.
- Low dielectric loss for clean signal transmission
- Stable dielectric constant (Dk)
- Lightweight and cost-efficient
Double-Sided Rogers PCB
Double-sided Rogers PCBs feature conductive layers on both sides of the substrate, allowing for more complex circuit routing and improved performance.
- Improved signal integrity
- Better grounding and shielding
- Supports controlled impedance
Multilayer Rogers PCB
Multilayer Rogers PCBs are designed for complex systems requiring high-density routing and precise signal control.
- Up to 64-layer stackups
- Controlled impedance (±3Ω)
- Microstrip and stripline support
- Reduced EMI
High-Frequency RF PCB
These PCBs are specifically engineered for high-frequency operation, often exceeding 10 GHz.
- Ultra-low loss tangent (Df ≤ 0.001)
- Stable performance across wide frequency ranges
- Excellent impedance control
HDI Rogers PCB
HDI Rogers PCBs use microvias and fine-line technology to achieve compact, high-performance designs.
- Laser-drilled microvias (3 mil)
- Via-in-pad and stacked vias
- High routing density
| Item | Unit | Flex PCB |
| Max. Layers | L | 16 |
| Min. Finished Board Thickness | mm | 0.04 |
| Max. Size | mm | 500 × 2200 |
| Min. Laser Drill Hole | mm | 0.025 |
| Min. Mechanical Drill Hole | mm | 0.1 |
| Min. Line Width / Spacing | mm | 0.035 / 0.035 |
| Min. Annular Ring (Single / Double Side) | mm | 0.075 |
| Min. Annular Ring (Multilayer Inner Layer) | mm | 0.1 |
| Min. Annular Ring (Multilayer Outer Layer) | mm | 0.1 |
| Min. Coverlay Bridge | mm | 0.1 |
| Min. Solder Mask Opening | mm | 0.15 |
| Min. Coverlay Opening | mm | 0.30 × 0.30 |
| Min. BGA Pitch | mm | 0.45 |
| Single-ended Impedance Tolerance | % | ±7 |
| Base Material Type | / | Polyimide, LCP, PET |
| Base Material Brands | / | Shengyi, ITEQ, Taiflex, Newflex, Nikko, Panasonic, DuPont, Jiujiang |
| Stiffener Types | / | FR4, PI, PET, Steel, Aluminum, PSA, Nylon |
| Surface Finish | / | ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin |
| Flex + HDI | / | 2+N+2 (Mass production) |
Rogers PCB Materials
Compared to traditional FR4, Rogers PCB provided significantly lower dielectric loss, stable dielectric constants, and superior thermal reliability.
We utilize premium laminates from Rogers Corporation to produce high-performance Rogers PCBs tailored for RF, microwave, and high-speed digital systems.
RO4000 Series
The RO4000 series combines the electrical performance of PTFE materials with the manufacturability of FR4.
Material | Dielectric Constant (Dk) | Dissipation Factor (Df) | Material Type |
RO4350B | 3.48 ± 0.05 | 0.0037 | Non-PTFE (hydrocarbon/ceramic) |
RO4835 | 3.48 ± 0.05 | 0.0031 | Non-PTFE (enhanced stability) |
RO3000 Series
The RO3000 series is designed for applications requiring extremely low dielectric loss and tight tolerance.
Material | Dielectric Constant (Dk) | Dissipation Factor (Df) | Material Type |
RO3003 | 3.00 ± 0.04 | 0.0010 | PTFE-based |
RO3035 | 3.50 ± 0.05 | 0.0015 | PTFE-based |
RO3203 | 3.02 ± 0.04 | 0.0016 | PTFE-based |
RT/Duroid Series
RT/duroid laminates offer the lowest dielectric constant and loss among Rogers materials.
Material | Dielectric Constant (Dk) | Dissipation Factor (Df) | Material Type |
RT/duroid 5880 | 2.20 ± 0.02 | 0.0009 | PTFE-based |
RT/duroid 6002 | 2.94 ± 0.04 | 0.0012 | PTFE-based |
TMM Series
TMM materials provide a balance between electrical performance and mechanical durability.
Material | Dielectric Constant (Dk) | Dissipation Factor (Df) | Material Type |
TMM3 | 3.27 ± 0.04 | 0.0020 | Thermoset ceramic-filled |
TMM10 | 9.20 ± 0.20 | 0.0020 | Thermoset ceramic-filled |
Prepreg & Bondply Materials
These materials are used for bonding layers in multilayer Rogers PCBs.
Material | Dielectric Constant (Dk) | Dissipation Factor (Df) | Material Type |
RO4450F (prepreg) | 3.52 ± 0.05 | 0.0040 | RO4400 Series Prepreg |
2929 Bondply | 2.94 ± 0.05 | 0.0030 | PTFE-based thermoset adhesive |
Rogers PCB Feature
Our Rogers PCBs are specifically designed to meet the demanding requirements of RF, microwave, and high-speed digital applications.
Low Dielectric Constant
Rogers materials offer a stable dielectric constant ranging from 2.2 to 10.2, enabling accurate impedance matching and reduced signal delay.
- Faster signal propagation
- Improved impedance control
- Reduced signal distortion
Ultra-Low Dissipation Factor
Rogers PCB is extremely low-loss tangent, with values as low as 0.0009.
- Reduced signal attenuation
- Enhanced RF performance
- Improved transmission efficiency over long distances
Excellent Signal Integrity
Rogers PCBs can maintain consistent electrical properties even at frequencies exceeding 10 GHz and up to 77 GHz.
- Low insertion loss
- Reduced electromagnetic interference (EMI)
- Clean signal transmission
Superior Thermal Stability
Rogers materials are engineered to withstand extreme thermal conditions without degrading performance.
- Prevents warping and delamination
- Ensures long-term reliability
- Ideal for high-power applications
Low CTE
Rogers PCBs show a low Z-axis CTE of 10–17 ppm/°C, ensuring dimensional stability during temperature changes.
- Improved plated through-hole (PTH) reliability
- Reduced mechanical stress
- Better multilayer alignment
Low Moisture Absorption
Rogers materials absorb is significantly less moisture than FR4.
- Stable dielectric properties in humid conditions
- Reduced risk of delamination
- Increased product lifespan
How To Choose Rogers PCB Materials
It is important to choose the right Rogers PCB material because it directly impacts PCBs’ signal integrity, thermal reliability, and overall system performance.
1. Define Your Operating Frequency
Frequency is the most important factor when selecting Rogers materials.
- Below 10 GHz: RO4000 Series (e.g., RO4350B, RO4003C)
- 10 GHz – 40 GHz: RO3000 Series (e.g., RO3003, RO3010)
- Above 40 GHz (Millimeter-Wave): RT/Duroid Series (e.g., 5880, 6002)
2. Evaluate Dielectric Constant (Dk)
The dielectric constant affects signal speed, impedance, and circuit size.
- Low Dk (2.2 – 3.5): Ideal for RF and microwave circuits
- High Dk (6 – 10.2): Suitable for compact designs
3. Consider Dissipation Factor (Df)
Df determines how much signal energy is lost as heat.
- Ultra-Low Loss (Df ≤ 0.001): PTFE-based materials
- Moderate Loss (Df ≤ 0.0037): Suitable for most RF and high-speed designs
4. Thermal Requirements
Thermal performance is crucial for reliability, especially in high-power applications.
- High-Temperature Environments: TMM series or RO4000 series
- Power Applications: Choose materials with higher thermal conductivity
5. Mechanical Stability
Mechanical properties affect durability and manufacturing reliability.
Important Factors:
- CTE (Z-axis: 10–17 ppm/°C)
- Dimensional stability
- Peel strength
6. Moisture Absorption
Moisture can significantly impact high-frequency performance.
- Choose materials with <0.05% moisture absorption
- Critical for outdoor, aerospace, and telecom applications
Rogers PCB Manufacturing
Our Rogers PCB fabrication process is engineered to maintain signal integrity, impedance stability, and structural durability in all production stages.
Design Review
It begins with a comprehensive engineering review:
- Analyze Gerber files and stackup design
- Select appropriate Rogers material
- Define impedance requirements and tolerance (±3Ω)
- Evaluate Dk/Df performance
Material Preparation
Rogers materials, especially PTFE-based laminates, require controlled preparation:
- Pre-baking at 110°C – 125°C for 30–60 minutes
- Moisture removal to prevent delamination
- Stabilization of dielectric properties
Inner Layer Imaging
It made High-Precision Circuit Pattern Formation
- Apply photoresist to copper-clad laminate
- UV exposure using high-resolution artwork
- Chemical etching to form circuit traces
Lamination Process
It ensures strong interlayer bonding and stable dielectric thickness.
- Use prepreg materials
- Apply controlled pressure and temperature
- Align layers precisely for multilayer builds
Drilling
Precision drilling ensures reliable electrical connections and supports high-density designs.
- Through-hole vias
- Blind and buried vias
- Via-in-pad
Plasma Treatment
It can improve copper adhesion and ensure reliable plated through-hole (PTH) performance.
- CF4/O2 plasma cleaning
- Removes residue and activates hole walls
Copper Plating
It can ensures strong conductivity and mechanical reliability.
Outer Layer Imaging
It is important for RF performance and signal consistency.
Solder Mask
It can protect circuits and improve high-frequency performance.
Surface Finish
We offer various of surface finish methods.
- ENIG (preferred for RF applications)
- Immersion Silver
- OSP
- Lead-Free HASL
Testing
Every Rogers PCB undergoes rigorous testing:
- AOI
- X-ray inspection
- Impedance testing
- Electrical testing
- Microsection analysis
Final Inspection
It is ready for Assembly or Integration.
Rogers PCB Applications
Our Rogers PCBs are widely used in telecommunications infrastructure and aerospace systems.
Automotive
Advanced driver-assistance systems (ADAS) rely on high-frequency radar modules, typically operating at 24 GHz and 77 GHz.
- Collision avoidance radar
- Adaptive cruise control
- Blind spot detection
- Autonomous driving sensors
Industrial Automation
Rogers PCBs are used in industrial systems requiring high-speed signal transmission and reliability.
- Industrial RF controllers
- High-speed data processing units
- Power amplifiers
Medical Electronics
High-frequency Rogers PCBs are used in advanced medical equipment.
- MRI systems
- RF imaging devices
- Diagnostic equipment
Telecommunication
Rogers PCBs are essential for modern communication systems operating at high frequencies and wide bandwidths.
- 5G base stations
- RF antennas and transceivers
- Power amplifiers
- Signal filters
Aerospace
Rogers PCBs are widely used in aerospace and military systems where performance and durability are critical.
- Satellite communication systems
- Radar and surveillance systems
- Avionics and navigation equipment
- Electronic warfare systems
Power Amplifiers
Rogers PCBs are ideal for high-power RF applications requiring efficient heat dissipation.
- RF power amplifiers
- Broadcast transmitters
- High-power communication systems
Fast Quotation
Our professional sales and engineering teams provide fast PCB quotes and technical support. Simply send us your Gerber files, BOM, and assembly drawings, and we will respond promptly with a competitive solution.
- Gushu Tangxi Second Industrial Zone, Shenzhen
- +86 755 2335 0814
- +86 135 1078 8094
- sales@pcbasail.com
FAQ About Rogers PCB
1. What is a Rogers PCB
A Rogers PCB is made by high-frequency laminate materials developed by Rogers Corporation.
These materials offer low dielectric loss, stable dielectric constant (Dk), and excellent thermal performance, making them ideal for RF, microwave, and high-speed applications.
2. What Is The Difference Between Rogers PCB And FR4 PCB?
Rogers PCB:
- Low dielectric loss (Df as low as 0.0009)
- Stable Dk for precise impedance control
- Suitable for high-frequency (>1 GHz)
- Lower cost
- Higher dielectric loss
- Suitable for general electronics
3. What Are The Most Common Rogers PCB Materials?
Common Rogers materials include:
- RO4350B
- RO4003C
- RO3003
- RO3010
- RT/duroid 5880
- TMM series
4. What Is Dielectric Constant (Dk) And Why Is It Important?
Dielectric constant (Dk) measures how a material stores electrical energy.
- Lower Dk → Faster signal transmission
- Stable Dk → Better impedance control
In Rogers PCB design, Dk typically ranges from 2.2 to 10.2.
5. What Is Dissipation Factor (Df)?
Dissipation factor (Df), also known as loss tangent, indicates how much signal energy is lost as heat.
- Lower Df: Less signal loss
- Rogers materials can have Df as low as 0.0009
6. Can Rogers PCB Be Combined With FR4?
Yes, Rogers materials can be combined with FR4 in a hybrid stackup.
- Reduced cost
- Maintained RF performance on critical layers
- Flexible design options
7. What Frequencies Can Rogers Pcbs Support?
Rogers PCBs can support:
- Standard RF: up to 10 GHz
- Advanced RF: 10–40 GHz
- Millimeter-wave: up to 77 GHz and beyond
8. What Is The Typical Lead Time For Rogers PCB Manufacturing?
Lead time depends on complexity:
- Prototype: 5–10 working days
- Mass production: 2–4 weeks
Dynamic flex designs are commonly used in hinges, robotics, and camera modules.
9. What Surface Finishes Are Available for Rogers PCBs?
We can offer:
- ENIG (preferred for RF applications)
- Immersion Silver
- OSP
- Lead-Free HASL