/Tg ≥170°C. Low CTE, Fast Turnaround/
High Tg PCB
High Tg PCB is designed to withstand elevated thermal loads, repeated thermal cycling, and harsh working conditions. It ensures long-term reliability in mission-critical electronics.
At PCBSAIL, we manufacture high-performance High-Tg PCBs using advanced laminates and precision-controlled fabrication processes.
From multilayer boards to RF and heavy copper designs, we provide complete High Tg PCBs. If your project involves high temperature, high power, or harsh environments, we are your trusted partner for precision-engineered High-Tg PCBs.
High Tg PCB Manufacturer.
We are a professional High Tg PCB manufacturer in China, specializing in high-performance circuit boards for demanding applications.
With a strong focus on thermal reliability, signal integrity, and precision fabrication, we deliver advanced High Tg PCBs for automotive, industrial control, telecommunications, aerospace, and high-power electronics.
Our core strength lies in manufacturing complex PCB structures using high-performance materials from globally recognized suppliers such as:
With vertically integrated production and experienced engineering teams, we help customers reduce cost, shorten lead time, and improve product reliability.
Layer Count & Stack-Up Capability
We can offer High-Tg PCBs with complex multilayer for high-density and high-performance applications:
- Up to 64 layers
- Sequential lamination for HDI structures
- Hybrid stack-ups (FR4 + high-frequency materials)
- Symmetrical and asymmetrical stack designs
- Controlled impedance stack-ups (50Ω / 100Ω differential)
Material Processing
We process a wide range of high-temperature laminates with controlled Tg, Td, and CTE performance:
- High Tg FR4 (Tg ≥170°C)
- IT180, S1000-2M
- Rogers series (e.g., 4350B)
- PTFE (Teflon-based materials)
- Polyimide (Tg up to 250°C+)
- Ceramic-filled laminates
- Metal core substrates (Aluminum / Copper)
Trace, Spacing & Imaging Precision
Our advanced imaging and etching processes enable fine circuit definition for high-density designs:
- Minimum trace/space: 1.8 mil / 1.8 mil
- High-resolution LDI (Laser Direct Imaging)
- Tight registration control for multilayer alignment
- Fine-pitch BGA and high-speed signal routing support
Feature High Tg PCB.
We provide a full range of High Tg PCB solutions tailored to different industries and technical requirements.
High Tg PCB We Offer.
High Tg Multilayer PCB
Our High Tg multilayer PCBs are made for complex electronic systems requiring high routing density and thermal stability.
- Up to 64 layers
- Controlled impedance (50Ω / 100Ω differential)
- High-density routing for compact layouts
- Sequential lamination for advanced stack-ups
High-Tg HDI PCB
Built for miniaturization and high-speed performance, our High-Tg HDI PCBs support advanced packaging technologies.
- Laser-drilled microvias
- Blind & buried vias
- Stacked and staggered via structures
- Via-in-pad with resin filling and copper capping
High-Tg Metal Core PCB
These boards use High-Tg materials with metal cores for superior heat dissipation.
- Excellent thermal conductivity
- Efficient heat spreading
- Increased power handling
High-Tg RF & High-Frequency PCB
Designed for high-speed signal transmission, these PCBs use High-Tg materials with low dielectric loss laminates.
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Stable signal integrity under heat
High-Tg Heavy Copper PCB
Engineered for high-current applications, these PCBs feature thick copper layers combined with High-Tg substrates.
- High current carrying capacity
- Reduced thermal buildup
- Improved durability
Item | Capability |
Layer Count | 2–28 layers (two to twenty-eight) |
Base Materials | High-Tg FR-4 (e.g., S1000-2M, IT-180A; Tg ≥170 °C — greater than or equal to one hundred seventy) |
Glass Transition Temp (Tg) | 170–180 °C (one hundred seventy to one hundred eighty) |
Decomposition Temp (Td) | ≥340 °C (greater than or equal to three hundred forty) |
Board Thickness | 0.6–3.2 mm (zero point six to three point two) |
Copper Weight | 1–3 oz (one to three ounces) |
Min Trace/Space | 100/100 μm (4/4 mil; one hundred by one hundred micrometers) |
Min Hole Size (Mechanical) | 0.20 mm (eight mils) |
Max Panel Size | 571.5 × 609.6 mm |
Surface Finish | Lead-Free HASL, ENIG, OSP |
Quality Testing | AOI, E-test, Impedance Checks |
Certifications | ISO 9001, UL, RoHS/REACH |
Lead Time | 5–10 days (five to ten) |
High Tg PCB Materials
High-Tg PCB materials are substrates with a glass transition temperature (Tg) typically ≥170°C.
When we are choosing the right laminate, we need to review glass transition temperature (Tg), decomposition temperature (Td), coefficient of thermal expansion (CTE), dielectric properties (Dk/Df), and thermal conductivity.
High-Tg FR4
High-Tg FR4 is the most widely used material for high-temperature PCB applications.
Typical Properties:
- Tg: 170–180°C
- Td: ≥300°C
- CTE-z: 45–55 ppm/°C
Advantages:
- Cost-effective
- Good mechanical strength
- Compatible with standard PCB processes
IT180 (High-Tg FR4)
IT180 is a high-performance laminate widely used in multilayer PCBs.
Key Specifications:
- Tg: 180°C
- Td: 345°C
- CTE-z: ~45 ppm/°C
- T260/T288: 60 min / 20 min
Benefits:
- Excellent thermal endurance
- Strong delamination resistance
- Reliable in high-layer-count boards
S1000-2M (High Reliability FR4)
S1000-2M is one of the most recommended materials for high-reliability applications.
Key Specifications:
- Tg: 180°C
- Td: 345°C
- Low CTE for via reliability
Advantages:
- Superior dimensional stability
- Long service life under thermal stress
- Excellent multilayer performance
Rogers 4350B
Rogers 4350B is a premium laminate combining high Tg with excellent RF performance.
Key Properties:
- Tg: ~280°C
- Td: ~390°C
- Dk: ~3.48
- Low dissipation factor (Df)
Advantages:
- Stable dielectric properties at high temperatures
- Low signal loss
- Ideal for high-frequency designs
Polyimide
Polyimide are designed for extreme temperature environments.
Typical Properties:
- Tg: 240–260°C+
- Excellent thermal and chemical resistance
Benefits:
- Withstands extreme thermal cycling
- High mechanical strength at elevated temperatures
- Excellent reliability in harsh conditions
PTFE
PTFE are used when both thermal stability and high-frequency performance are required.
Key Characteristics:
- Low dielectric constant (Dk)
- Low signal loss
- Good thermal resistance
Advantages:
- Ideal for high-speed and RF circuits
- Stable performance under temperature variation
High Tg PCB Feature
High-Tg PCBs can maintain structural integrity and electrical performance under elevated temperatures and harsh operating conditions.
High Thermal Stability
High-Tg PCBs can run reliably at temperatures exceeding 170°C.
- Maintains rigidity during lead-free soldering
- Prevents warping under continuous heat exposure
- Ensures consistent electrical performance
Low CTE
High-Tg materials can reduce expansion when exposed to heat.
- CTE-z typically ≤ 45–55 ppm/°C
- Minimizes stress between layers
- Reduces solder joint fatigue
Excellent Thermal Shock Resistance
High-Tg PCBs can withstand rapid temperature fluctuations without mechanical failure.
- Resists cracking and delamination
- Maintains layer bonding integrity
- Performs reliably in harsh thermal environments
Strong Mechanical Strength
High-Tg materials provide enhanced rigidity and durability.
- Maintains structural stability under stress
- Reduces deformation during assembly
- Supports heavy components and dense layouts
High Delamination Resistance
High-Tg PCBs can resist layer separation under thermal stress.
- T260/T288 resistance up to 60 minutes
- Strong adhesion between resin and copper layers
- Long-term reliability in high-temperature environments
High Tg PCB Manufacturing
High-Tg PCBs’ manufacturing requires tighter process control, specialized materials, and optimized thermal handling.
Every stage is engineered to preserve the thermal, mechanical, and electrical integrity of high-Tg laminates throughout production.
Material Selection
We will choose the appropriate High-Tg laminate.
- Tg (≥170°C or higher depending on design)
- Td (decomposition temperature ≥300°C)
- CTE (low expansion for via reliability)
- Dielectric properties for signal integrity
Engineering Review
A precise stack-up is important for thermal stability and electrical performance.
- Layer count and symmetry design
- Impedance calculation (50Ω / 100Ω differential)
- Thermal expansion matching between core and prepreg
- DFM validation
Inner Layer Imaging
Circuit patterns are transferred onto copper-clad laminates.
- Photoresist coating
- Laser Direct Imaging (LDI) for high precision
- UV exposure and development
Inner Layer Etching
Unwanted copper is removed to form the circuit traces.
Oxide Treatment
Inner layers undergo oxide or alternative treatment to improve bonding strength.
Lamination
Multiple layers are bonded under controlled heat and pressure.
Drilling
Holes and vias are created for interlayer connections.
- Mechanical drilling down to 0.1 mm
- Laser drilling for microvias (HDI)
Desmear & Hole
After drilling, hole walls are cleaned to ensure proper metallization.
Copper Deposition
A thin copper layer is deposited inside the holes.
Outer Layer Etching
Outer circuit layers are defined using similar imaging and etching processes.
- Fine-line accuracy
- Alignment with inner layers
- Surface quality for assembly
Solder Mask
A protective layer is applied to prevent oxidation and short circuits.
Surface Finish
Surface finishes are applied to ensure solderability and durability.
- ENIG
- Immersion Silver / Tin
- OSP
- Hard Gold
Silkscreen
Component markings and identifiers are printed on the board.
Electrical Testing
Each PCB is tested to verify electrical integrity.
- Flying probe testing (prototypes)
- Fixture-based E-test (mass production)
Final Inspection
Comprehensive inspections ensure compliance with standards.
- AOI
- X-ray inspection
- TDR
- Dimensional Measurement
High Tg PCB Applications
High-Tg PCBs are widely used in industries where elevated temperatures, high power density, and long-term reliability are critical.
Automotive Electronics
The automotive industry requires PCBs that can withstand high temperatures, vibration, and continuous operation.
- Engine Control Units
- EV battery management systems
- Powertrain control modules
- ADAS
Industrial Equipment
Industrial electronics often work continuously under heavy loads and elevated temperatures.
- Motor drives and controllers
- Power distribution systems
- Automation and robotics
- PLC
Medical Electronics
Medical devices require highly reliable PCBs.
- Diagnostic imaging equipment
- Patient monitoring systems
- Surgical devices
- Portable medical electronics
Telecommunication
High-speed communication systems require the stable signal under thermal stress.
- 5G base stations
- RF communication modules
- Network switches and routers
- Optical transmission systems
Aerospace & Defense
Aerospace and military systems demand extreme reliability under high temperature and pressure conditions.
- Avionics systems
- Radar and communication modules
- Satellite electronics
- Navigation and control systems
Energy &Power Systems
Power electronics generate significant heat, requiring thermally robust PCB.
- Solar inverters
- Energy storage systems (ESS)
- Power converters and inverters
- Battery management systems (BMS)
Fast Quotation
Our professional sales and engineering teams provide fast PCB quotes and technical support. Simply send us your Gerber files, BOM, and assembly drawings, and we will respond promptly with a competitive solution.
- Gushu Tangxi Second Industrial Zone, Shenzhen
- +86 755 2335 0814
- +86 135 1078 8094
- sales@pcbasail.com
FAQ About High Tg PCB
1. What is a High-Tg PCB?
A High-Tg PCB is a printed circuit board made from materials with a glass transition temperature (Tg) typically above 170°C.
These materials maintain mechanical strength and electrical stability at elevated temperatures, making them suitable for high-performance and high-reliability applications.
2. What does Tg mean in PCB materials
Tg (Glass Transition Temperature) is the temperature at which a PCB substrate changes from a rigid, glassy state to a softer, rubbery state.
3. What is the difference between Tg and Td?
- Tg (Glass Transition Temperature): Point where material softens
- Td (Decomposition Temperature): Point where material chemically breaks down
High-Tg PCBs typically have Td values above 300°C, ensuring stability during soldering.
4. Can High-Tg PCBs handle lead-free soldering?
Yes. High-Tg PCBs are specifically designed to withstand lead-free reflow temperatures up to 245–260°C without deformation or failure.
5. What is CTE and why is it important?
CTE (Coefficient of Thermal Expansion) measures how much a material expands with temperature. Lower CTE:
- Reduces stress on vias and solder joints
- Improves multilayer alignment
- Enhances long-term reliability