/Tg ≥170°C. Low CTE, Fast Turnaround/
High Tg PCB
High Tg PCB is designed to withstand elevated thermal loads, repeated thermal cycling, and harsh working conditions. It ensures long-term reliability in mission-critical electronics.
At PCBSAIL, we manufacture high-performance High-Tg PCBs using advanced laminates and precision-controlled fabrication processes.
From multilayer boards to RF and heavy copper designs, we provide complete High Tg PCBs. If your project involves high temperature, high power, or harsh environments, we are your trusted partner for precision-engineered High-Tg PCBs.
High Tg PCB Manufacturer.
We are a professional High Tg PCB manufacturer in China, specializing in high-performance circuit boards for demanding applications.
With a strong focus on thermal reliability, signal integrity, and precision fabrication, we deliver advanced High Tg PCBs for automotive, industrial control, telecommunications, aerospace, and high-power electronics.
Our core strength lies in manufacturing complex PCB structures using high-performance materials from globally recognized suppliers such as:
With vertically integrated production and experienced engineering teams, we help customers reduce cost, shorten lead time, and improve product reliability.
Layer Count & Stack-Up Capability
We can offer High-Tg PCBs with complex multilayer for high-density and high-performance applications:
- Up to 64 layers
- Sequential lamination for HDI structures
- Hybrid stack-ups (FR4 + high-frequency materials)
- Symmetrical and asymmetrical stack designs
- Controlled impedance stack-ups (50Ω / 100Ω differential)
Material Processing
We process a wide range of high-temperature laminates with controlled Tg, Td, and CTE performance:
- High Tg FR4 (Tg ≥170°C)
- IT180, S1000-2M
- Rogers series (e.g., 4350B)
- PTFE (Teflon-based materials)
- Polyimide (Tg up to 250°C+)
- Ceramic-filled laminates
- Metal core substrates (Aluminum / Copper)
Trace, Spacing & Imaging Precision
Our advanced imaging and etching processes enable fine circuit definition for high-density designs:
- Minimum trace/space: 1.8 mil / 1.8 mil
- High-resolution LDI (Laser Direct Imaging)
- Tight registration control for multilayer alignment
- Fine-pitch BGA and high-speed signal routing support
Feature High Tg PCB.
We provide a full range of High Tg PCB solutions tailored to different industries and technical requirements.
High Tg PCB We Offer.
High Tg Multilayer PCB
Our High Tg multilayer PCBs are made for complex electronic systems requiring high routing density and thermal stability.
- Up to 64 layers
- Controlled impedance (50Ω / 100Ω differential)
- High-density routing for compact layouts
- Sequential lamination for advanced stack-ups
High-Tg HDI PCB
Built for miniaturization and high-speed performance, our High-Tg HDI PCBs support advanced packaging technologies.
- Laser-drilled microvias
- Blind & buried vias
- Stacked and staggered via structures
- Via-in-pad with resin filling and copper capping
High-Tg Metal Core PCB
These boards use High-Tg materials with metal cores for superior heat dissipation.
- Excellent thermal conductivity
- Efficient heat spreading
- Increased power handling
High-Tg RF & High-Frequency PCB
Designed for high-speed signal transmission, these PCBs use High-Tg materials with low dielectric loss laminates.
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Stable signal integrity under heat
High-Tg Heavy Copper PCB
Engineered for high-current applications, these PCBs feature thick copper layers combined with High-Tg substrates.
- High current carrying capacity
- Reduced thermal buildup
- Improved durability
Item | Capability |
Layer Count | 2–28 layers (two to twenty-eight) |
Base Materials | High-Tg FR-4 (e.g., S1000-2M, IT-180A; Tg ≥170 °C — greater than or equal to one hundred seventy) |
Glass Transition Temp (Tg) | 170–180 °C (one hundred seventy to one hundred eighty) |
Decomposition Temp (Td) | ≥340 °C (greater than or equal to three hundred forty) |
Board Thickness | 0.6–3.2 mm (zero point six to three point two) |
Copper Weight | 1–3 oz (one to three ounces) |
Min Trace/Space | 100/100 μm (4/4 mil; one hundred by one hundred micrometers) |
Min Hole Size (Mechanical) | 0.20 mm (eight mils) |
Max Panel Size | 571.5 × 609.6 mm |
Surface Finish | Lead-Free HASL, ENIG, OSP |
Quality Testing | AOI, E-test, Impedance Checks |
Certifications | ISO 9001, UL, RoHS/REACH |
Lead Time | 5–10 days (five to ten) |
High Tg PCB Materials
High-Tg PCB materials are substrates with a glass transition temperature (Tg) typically ≥170°C.
When we are choosing the right laminate, we need to review glass transition temperature (Tg), decomposition temperature (Td), coefficient of thermal expansion (CTE), dielectric properties (Dk/Df), and thermal conductivity.
High-Tg FR4
High-Tg FR4 is the most widely used material for high-temperature PCB applications.
Typical Properties:
- Tg: 170–180°C
- Td: ≥300°C
- CTE-z: 45–55 ppm/°C
Advantages:
- Cost-effective
- Good mechanical strength
- Compatible with standard PCB processes
IT180 (High-Tg FR4)
IT180 is a high-performance laminate widely used in multilayer PCBs.
Key Specifications:
- Tg: 180°C
- Td: 345°C
- CTE-z: ~45 ppm/°C
- T260/T288: 60 min / 20 min
Benefits:
- Excellent thermal endurance
- Strong delamination resistance
- Reliable in high-layer-count boards
S1000-2M (High Reliability FR4)
S1000-2M is one of the most recommended materials for high-reliability applications.
Key Specifications:
- Tg: 180°C
- Td: 345°C
- Low CTE for via reliability
Advantages:
- Superior dimensional stability
- Long service life under thermal stress
- Excellent multilayer performance
Rogers 4350B
Rogers 4350B is a premium laminate combining high Tg with excellent RF performance.
Key Properties:
- Tg: ~280°C
- Td: ~390°C
- Dk: ~3.48
- Low dissipation factor (Df)
Advantages:
- Stable dielectric properties at high temperatures
- Low signal loss
- Ideal for high-frequency designs
Polyimide
Polyimide are designed for extreme temperature environments.
Typical Properties:
- Tg: 240–260°C+
- Excellent thermal and chemical resistance
Benefits:
- Withstands extreme thermal cycling
- High mechanical strength at elevated temperatures
- Excellent reliability in harsh conditions
PTFE
PTFE are used when both thermal stability and high-frequency performance are required.
Key Characteristics:
- Low dielectric constant (Dk)
- Low signal loss
- Good thermal resistance
Advantages:
- Ideal for high-speed and RF circuits
- Stable performance under temperature variation
High Tg PCB Feature
High-Tg PCBs can maintain structural integrity and electrical performance under elevated temperatures and harsh operating conditions.
High Thermal Stability
High-Tg PCBs can run reliably at temperatures exceeding 170°C.
- Maintains rigidity during lead-free soldering
- Prevents warping under continuous heat exposure
- Ensures consistent electrical performance
Low CTE
High-Tg materials can reduce expansion when exposed to heat.
- CTE-z typically ≤ 45–55 ppm/°C
- Minimizes stress between layers
- Reduces solder joint fatigue
Excellent Thermal Shock Resistance
High-Tg PCBs can withstand rapid temperature fluctuations without mechanical failure.
- Resists cracking and delamination
- Maintains layer bonding integrity
- Performs reliably in harsh thermal environments
Strong Mechanical Strength
High-Tg materials provide enhanced rigidity and durability.
- Maintains structural stability under stress
- Reduces deformation during assembly
- Supports heavy components and dense layouts
High Delamination Resistance
High-Tg PCBs can resist layer separation under thermal stress.
- T260/T288 resistance up to 60 minutes
- Strong adhesion between resin and copper layers
- Long-term reliability in high-temperature environments
High Tg PCB Manufacturing
High-Tg PCBs’ manufacturing requires tighter process control, specialized materials, and optimized thermal handling.
Every stage is engineered to preserve the thermal, mechanical, and electrical integrity of high-Tg laminates throughout production.
Material Cutting
High-quality polyimide copper-clad laminates are precision-cut to panel size. Material thickness, copper weight, and grain direction are verified to ensure stable flex performance and consistent bend characteristics.
Mechanical
Via and hole structures are formed using mechanical drilling or UV/CO₂ laser drilling, depending on hole size and design requirements.
- Laser vias down to 0.1 mm
- Controlled hole wall quality for reliable plating
- Optimized for HDI and multilayer flex structures
Copper Electroplating
Electroless and electrolytic copper plating are applied to build uniform copper thickness within vias and on circuit traces, ensuring strong electrical continuity and mechanical reliability.
Dry Film Lamination
Photosensitive dry film is laminated onto the copper surface under controlled pressure and temperature, preparing the panel for precise circuit imaging.
Imaging & UV Exposure
Circuit patterns are transferred using high-resolution phototools and UV exposure systems. This step defines trace geometry, impedance-critical features, and fine-pitch structures.
Pattern Plating
Unexposed photoresist is developed away, followed by selective copper and tin plating on circuit features to reinforce traces and pads before etching.
Etching & Resist Stripping
Unwanted copper is chemically etched to form the final circuit pattern. Remaining photoresist and plating resist layers are stripped, leaving clean and accurate conductor geometries.
Surface Finishing
Surface finishes are applied to protect exposed copper and ensure solderability and contact reliability:
- OSP
- ENIG (Electroless Nickel Immersion Gold)
- Immersion Silver
Selective finishes such as ENIG + OSP are available for mixed-performance zones.
Coverlay Application
Polyimide coverlay films are precisely aligned and laminated to protect flexible traces while maintaining controlled openings for pads, connectors, and solder areas.
Pressing
Multi-layer flex or rigid-flex structures are thermally laminated under controlled heat and pressure to ensure layer integrity, adhesion strength, and dimensional stability.
Electrical Testing
All boards undergo comprehensive electrical inspection:
- AOI (Automated Optical Inspection) for pattern accuracy
- Flying probe testing for opens, shorts, and continuity
- Impedance verification for controlled-impedance designs
Final Inspection
Final inspections confirm mechanical dimensions, surface quality, and workmanship compliance with IPC standards. Boards are vacuum-sealed and packaged using ESD-safe materials to prevent damage during shipment.
