/High Thermal Conductivity/
High-Reliability Ceramic PCB
Ceramic PCB (Ceramic Printed Circuit Board) is a high-performance circuit board fabricated using ceramic substrates. It can offer superior thermal conductivity, excellent electrical insulation, and outstanding mechanical stability.
Our ceramic PCBs are manufactured under ISO 9001, ROHS, and UL-aligned quality systems. We will test its full material traceability, thermal validation, and electrical performance before we deliver it to you. It makes sure you will get high-performance Ceramic PCBs.
Ceramic PCB Manufacturer
PCBSAIL is a direct manufacturer, not a trading company.
All PCB fabrication and assembly processes are managed under our internal quality systems, from material selection and process engineering to final inspection and shipment.
We operate advanced production lines dedicated to:
- Ceramic PCB manufacturing (Al₂O₃, AlN, advanced ceramic substrates)
- High-power and thermal-critical PCB solutions
- Prototype and volume PCB assembly
Our customers include OEMs, EMS providers, design engineers, and system integrators across the USA, Europe, and Asia, working in industries where failure is not an option.
Engineering-Driven
At PCBSAIL, our manufacturing decisions are driven by engineering validation, not marketing claims. Every project begins with a design and manufacturability review (DFM) to verify:
- Material suitability (CTE matching, dielectric performance)
- Thermal dissipation requirements
- Metallization thickness and adhesion
- Via structure reliability
- Assembly compatibility and solder joint integrity
Ceramic PCB Capability
PCBSAIL is recognized for its ceramic PCB manufacturing expertise, delivering substrates with:
- Thermal conductivity up to 220 W/m·K
- Breakdown voltage up to 50 kV/mm
- Ultra-fine lines down to 0.05 mm
- Microvias as small as 0.1 mm
- Operating temperature ranges from −55°C to over 1000°C
Quality
Quality and consistency are core to PCBSAIL’s operations. Our manufacturing and inspection processes align with IPC standard:
- Incoming material verification
- Metallization thickness control
- AOI (Automated Optical Inspection)
- X-ray inspection and micro-section analysis
- Thermal cycling and thermal shock testing
- Dielectric breakdown and insulation resistance testing
- SPC-controlled process monitoring
Feature Ceramic PCB.
At PCBSAIL, we provide a comprehensive range of ceramic PCBs from industrial electronics to power modules and high-frequency RF systems.
Ceramic PCB We Offer.
Thick Film Ceramic PCB
Our Thick film ceramic PCBs are manufactured by screen printing conductive paste (such as silver, gold, or copper) directly onto ceramic substrates and then sintering at high temperature to form conductive circuits.
- Line precision: ~±50 µm
- Moderate thermal conductivity performance
- Good mechanical reliability
- Mature high-volume production process
Thin-Film Ceramic PCB
Our Thin film ceramic PCBs use vacuum deposition and photolithography to create ultra-fine circuit patterns on ceramic substrates. It can enable very high circuit density and excellent electrical performance.
- Precision: ±5 µm or better
- Very low dielectric loss
- Smooth surface finish
- Excellent RF performance
LTCC
LTCC uses multilayer ceramic green sheets with printed conductors and vias, co-fired at lower temperatures to create highly integrated multilayer ceramic circuits.
- Supports multilayer structures (often 10–50 layers)
- Can embed resistors and capacitors
- Good dimensional control
HTCC
HTCC ceramic PCBs are co-fired at very high temperatures using refractory metal conductors such as tungsten or molybdenum, creating extremely durable substrates.
- Extreme temperature resistance (>1200°C possible)
- Radiation resistance
- Very strong mechanical structure
DPC Ceramic PCB
DPC ceramic PCBs are manufactured by depositing a seed metal layer onto ceramic and building copper thickness through electroplating.
- Finer line capability vs DBC
- Lower parasitic capacitance and inductance
- Improved high-frequency performance
DBC Ceramic PCB
DBC ceramic PCBs are produced by bonding thick copper foil directly to ceramic substrates under high temperature. This creates extremely strong bonding and excellent heat spreading capability.
- Copper thickness: typically thick (>200 µm possible)
- Thermal conductivity: often >200 W/mK depending on ceramic
- High current carrying capability
Item | Unit | Ceramic PCB Process Capabilities |
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Minimum Hole Diameter | mm | 0.05 |
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Hole Taper Tolerance | % | ±30 |
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Drilling Position Accuracy | mm | 0.025 |
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Slot Tolerance: Length ≥ 2×Width | mm | Length: ±0.05; Width: ±0.025 |
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Slot Tolerance: Length < 2×Width | mm | Length: ±0.025; Width: ±0.010 |
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Trace Alignment Accuracy | mm | ±0.025; Interlayer Alignment: 0.025 |
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Minimum Line Width/Spacing | mm | 0.075/0.040 |
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Overall Line Width Compensation (DPC Process) | mm | 0.02 (No copper thickness restriction, DPC process only) |
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Negative Film Direct Etching Process | mm | 10Z copper thickness: 0.025 line width compensation; 20Z copper thickness: 0.05 line width compensation; 30Z copper thickness: 0.075 line width compensation; 80Z copper thickness: 0.15 line width compensation |
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Surface Copper Thickness | um | 18, 35, 70, 140, 300, 400 |
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Hole Aspect Ratio | / | 8:1 |
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Etch Factor | / | ＞4 |
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Metal Dam | um | 50 – 800 |
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Ink Thickness (Per customer’s requirement if specified) | um | Trace Surface: ≥10; Trace Corner: ≥8 |
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Weir Ink Thickness | um | 80 – 120 |
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Solder Mask Alignment Tolerance | mm | ±0.075 |
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Minimum Single-Side Width of Solder Mask Covering Trace | mm | 10Z surface copper: 0.075; 20Z surface copper: 0.10; 30Z surface copper: 0.15; 40Z surface copper: 0.175 |
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Minimum Opening of Solder Mask Film Character (Minimum Line Width) | mm | 0.15 |
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Minimum Character Line Width | mm | ≥0.12 |
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Character Alignment Tolerance | mm | ±0.15 |
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Minimum Character Height | mm | ≥0.75 |
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Minimum Character Spacing | mm | ≥0.10 |
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Immersion Gold | um | Gold Thickness: 0.025 – 0.10; Nickel Thickness: 2 – 8 |
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Immersion Silver | um | Silver Thickness: 0.2 – 0.5 |
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Immersion Tin | um | Tin Thickness: 0.2 – 1 (Hot Air Solder Leveling is not applicable for ceramic boards) |
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OSP (Oxidation Resistance) | / | OSP Film Thickness: 2 – 5 u” |
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Electroless Nickel Palladium Gold (ENEPIG) | um | Gold Thickness: 0.025 – 0.050; Palladium Thickness: 0.025 – 0.075; Nickel Thickness: 2 – 8 |
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Minimum Distance from Cutting Line to Trace | mm | 0.2 |
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Alignment of Upper & Lower Cutting Lines (Controlled for Double-Sided Scribed Boards) | mm | ±0.025 |
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Residual Thickness Control Accuracy | mm | ±0.075; Scribing Depth for Panelized Boards: 1/2 of total board thickness; Scribing Depth for Peripheral Depaneling Lines: 2/3 of total board thickness |
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Offset Accuracy Tolerance | mm | ±0.025 |
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Laser Cutting Line Width | mm | 0.1 |
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Laser Profile Tolerance | mm | ±0.10 |
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LTCC Process Sintered Silver Paste – Thickness | um | 10 – 20 |
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LTCC Process Sintered Silver Paste – Line Width | mm | ＞0.1 |
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LTCC Process Sintered Silver Paste – Line Spacing | mm | ＞0.15 |
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Material | – | Alumina | Alumina | Aluminum Nitride |
Purity | % | 96 | 99.60 | / |
Appearance | / | White | White | Cyan |
Density | g/cm³ | 3.72 | 3.85 | 3.3 |
Average Particle Size | um | 3 – 4 | ＜1.5 | ＜1 |
Thermal Conductivity | w/m·k | 22.3 | 29.5 | 170 |
Coefficient of Thermal Expansion (CTE) | x10⁻⁶/℃ (RT~800℃) | 8 | 8.2 | 4.4 |
Dielectric Breakdown Strength | v/m | 14×10⁶ | 18×10⁶ | 14×10⁶ |
Resistivity | / | ＞10¹⁴ | ＞10¹⁴ | ＞10¹⁴ |
Dielectric Constant | (1MHz) | 9.5 | 9.8 | 9 |
Dielectric Loss Tangent | (1MHz, x10⁻⁴) | 3 | 2 | 4 |
Flexural Strength | Mpa | 350 | 500 | 300 |
Dimension | mm | 114×114/120×120/127×127/130×140/140×190 | – | – |
Thickness | mm | 0.2/0.25/0.3/0.38/0.5/0.635/0.8/1.0/1.2/1.5 | – | – |
Warpage | % | ≤0.3 | ≤0.3 | ≤0.3 |
Ceramic PCB Substrate Materials
We offer a wide range of ceramic substrate PCB.Each material is selected based on specific application requirements such as power density, operating temperature, mechanical stress, and frequency performance.
1. Alumina (Al₂O₃) Ceramic PCB
Alumina is the most widely used ceramic PCB substrate. It is excellent in cost, mechanical strength, and electrical performance.
- Thermal Conductivity: 20–30 W/m·K
- Dielectric Constant: ~9.4 – 9.8
- CTE: 6–8 ppm/°C
- Operating Temperature: Up to 800°C+
- High chemical and corrosion resistance
2. Aluminum Nitride (AlN) Ceramic PCB
AlN is the preferred material when maximum heat dissipation and silicon CTE matching are required.
- Thermal Conductivity: 170–220 W/m·K
- CTE: ~4–4.5 ppm/°C (close to silicon)
- Dielectric Constant: ~8–9
- Operating Temperature: Up to 1000°C+
3. Silicon Nitride (Si₃N₄) Ceramic PCB
Silicon Nitride offers a unique combination of thermal conductivity and exceptional mechanical strength.
- Thermal Conductivity: ≥85 W/m·K
- CTE: ~2.6–3 ppm/°C
- Very high flexural strength
- High fracture toughness
4. Beryllium Oxide (BeO) Ceramic PCB
BeO offers one of the highest thermal conductivities among ceramic PCB materials, but requires strict safety handling protocols.
- Thermal Conductivity: 220–350 W/m·K
- Dielectric Constant: ~6.5–7
- Excellent electrical insulation
5. Silicon Carbide (SiC) Ceramic PCB
Silicon Carbide is designed for extreme temperature and harsh chemical environments.
- Thermal Conductivity: 120–200 W/m·K
- Excellent chemical resistance
- Very high hardness
- High temperature stability
Ceramic PCB Feature
At PCBSAIL, our ceramic PCBs are engineered to deliver high reliability, thermal efficiency, and precision performance for demanding electronic applications.
Excellent Thermal Conductivity
We manufacture ceramic PCBs using high-performance materials such as Alumina (Al₂O₃), Aluminum Nitride (AlN), and Silicon Nitride (Si₃N₄) to ensure efficient heat dissipation.
- Alumina: 20–30 W/m·K
- Aluminum Nitride: 170–220 W/m·K
- Silicon Nitride: ≥85 W/m·K
Extreme Temperature Stability
Our ceramic substrates are designed for stable performance under extreme temperature conditions.
- Operating range: -55°C to 800°C+ (material dependent)
- High thermal shock resistance
- Minimal thermal degradation over tim
Precision Circuit Patterning
Using advanced metallization and laser processing technologies, we achieve ultra-fine circuit structures.
- Minimum trace/space: 0.05 mm
- Micro via size: ≥0.1 mm
- Controlled metallization thickness
Low CTE Matching
Our ceramic PCBs are designed to closely match the thermal expansion of semiconductor chips.
- 3–7 ppm/°C range depending on material
Excellent Electrical Insulation
Ceramic materials provide strong electrical isolation and stable dielectric performance.
- Breakdown voltage: up to 10–50 kV/mm
- Low dielectric loss (<0.0002 typical)
- Stable dielectric constant
Multi-Layer Ceramic PCB
We support ceramic PCB structures from single layer to multi-layer designs.
- Single layer to 8-layer ceramic PCBs
- Hybrid ceramic structures available
- LTCC multilayer integration capability
Ceramic PCB Manufacturing
At PCBSAIL, ceramic PCB manufacturing is performed under strict process control and quality management systems. It can ensure consistent performance from prototype development to high-volume production.
Ceramic Raw Material
The manufacturing process begins with selecting high-purity ceramic materials based on application requirements.
- Alumina (Al₂O₃) – Cost-effective, balanced performance
- Aluminum Nitride (AlN) – High thermal conductivity, chip-level CTE matching
- Silicon Nitride (Si₃N₄) – Excellent mechanical strength and thermal shock resistance
Circuit Pattern Formation
Circuit traces are created using specialized metallization technologies.
Thick Film Process
- Screen printing conductive paste
- Conductor thickness typically 10–15 μm
- Suitable for power electronics
- Vacuum sputtering seed layer
- Electroplated copper build-up
- Suitable for high-frequency and fine-pitch circuits
Laser Drilling and Via
Laser drilling is the primary via formation method in ceramic PCBs due to ceramic hardness and brittleness.
- Via diameter: 0.05 – 0.30 mm
- High positional accuracy
- Minimal mechanical stress
Multilayer Lamination
For multilayer ceramic PCBs, layers are aligned and laminated using high pressure and controlled temperature conditions.
- Precision alignment tooling
- Vacuum lamination to prevent voids
- Moisture removal pre-baking
High Temperature Sintering
Sintering permanently bonds ceramic particles and conductor materials into a dense, stable structure.
- LTCC: 850 – 1000°C
- HTCC: 1300 – 1600°C
Copper Metallization
Depending on design requirements, additional copper thickness is added through plating or bonding processes.
- Direct Plated Copper (DPC)
- Direct Bonded Copper (DBC)
- Electroplating copper thickness build-up
Surface Finish Processing
Surface finishes improve solderability and protect exposed metal.
- ENIG
- ENEPIG
- Immersion Silver
- Immersion Tin
- Thick Film Gold
Electrical Testing
Every ceramic PCB undergoes comprehensive electrical and environmental validation.
- Electrical continuity testing
- Dielectric breakdown testing
- Thermal cycling testing
- X-ray inspection of vias and layers
Final Inspection
Final inspections confirm mechanical dimensions, surface quality, and workmanship compliance with IPC standards. Boards are vacuum-sealed and packaged using ESD-safe materials to prevent damage during shipment.
| Item | Unit | Flex PCB |
| Max. Layers | L | 16 |
| Min. Finished Board Thickness | mm | 0.04 |
| Max. Size | mm | 500 × 2200 |
| Min. Laser Drill Hole | mm | 0.025 |
| Min. Mechanical Drill Hole | mm | 0.1 |
| Min. Line Width / Spacing | mm | 0.035 / 0.035 |
| Min. Annular Ring (Single / Double Side) | mm | 0.075 |
| Min. Annular Ring (Multilayer Inner Layer) | mm | 0.1 |
| Min. Annular Ring (Multilayer Outer Layer) | mm | 0.1 |
| Min. Coverlay Bridge | mm | 0.1 |
| Min. Solder Mask Opening | mm | 0.15 |
| Min. Coverlay Opening | mm | 0.30 × 0.30 |
| Min. BGA Pitch | mm | 0.45 |
| Single-ended Impedance Tolerance | % | ±7 |
| Base Material Type | / | Polyimide, LCP, PET |
| Base Material Brands | / | Shengyi, ITEQ, Taiflex, Newflex, Nikko, Panasonic, DuPont, Jiujiang |
| Stiffener Types | / | FR4, PI, PET, Steel, Aluminum, PSA, Nylon |
| Surface Finish | / | ENIG, ENEPIG, OSP, Electroplated Gold, Electroplated Gold + ENIG, Electroplated Gold + OSP, Immersion Silver, Immersion Tin, Electroplated Tin |
| Flex + HDI | / | 2+N+2 (Mass production) |
Ceramic PCB Applications
Ceramic PCBs are widely used in advanced electronic systems that demand high thermal conductivity, electrical insulation, mechanical strength, and long-term reliability. Compared with FR-4 or metal-core PCBs, ceramic substrates enable stable operation in high-temperature, high-power, and high-frequency environments.
Power Electronics
Ceramic PCBs are a core technology in power conversion and high-current applications.
- IGBT modules
- MOSFET power modules
- Inverters and converters
- Solar and renewable energy systems
- Motor drives and industrial automation
LED
Thermal management is critical for LED lifetime and brightness stability, making ceramic PCBs a preferred substrate.
- High-power LED modules
- Automotive headlights
- UV and IR LEDs
- Laser drivers
Automotive Electronics
Modern vehicles require electronics that tolerate heat, vibration, and harsh chemical environments.
- Engine control modules (ECU)
- Powertrain electronics
- EV battery management systems
- ADAS sensors and radar modules
Medical Electronics
Ceramic PCBs are used in devices requiring precision, reliability, and sterilization resistance.
- Implantable electronics
- Medical imaging systems
- Surgical laser equipment
- Monitoring and diagnostic equipment
Telecommunication
Ceramic PCBs support high-frequency signal integrity and dense circuit integration.
- RF power amplifiers
- Base station modules
- Microwave communication systems
- 5G infrastructure components
Fast Quotation
Our professional sales and engineering teams provide fast PCB quotes and technical support. Simply send us your Gerber files, BOM, and assembly drawings, and we will respond promptly with a competitive solution.
- Gushu Tangxi Second Industrial Zone, Shenzhen
- +86 755 2335 0814
- +86 135 1078 8094
- sales@pcbasail.com
FAQ About Ceramic PCB
1. What Is A Ceramic PCB?
A Ceramic PCB is a circuit board that uses ceramic materials such as Alumina (Al₂O₃), Aluminum Nitride (AlN), or Silicon Nitride (Si₃N₄) as the substrate instead of traditional FR-4 epoxy glass.
These substrates provide superior thermal conductivity, electrical insulation, and high-temperature stability, making them ideal for high-power and high-frequency electronics.
2. Why Choose Ceramic PCBs Instead of FR-4 PCBs
Ceramic PCBs are selected when thermal management, reliability, or dimensional stability are critical.
Key Advantages:
- Much higher thermal conductivity (especially AlN)
- Low coefficient of thermal expansion (CTE)
- Excellent electrical insulation
- High temperature resistance
- Strong chemical and corrosion resistance
3. What Ceramic Materials Are Most Commonly Used?
The most common ceramic PCB substrate materials include:
Alumina (Al₂O₃)
- Cost-effective and widely available
- Good insulation performance
- Moderate thermal conductivity
Aluminum Nitride (AlN)
- Very high thermal conductivity (often >150 W/m·K)
- Excellent electrical insulation
- Ideal for high-power density electronics
AlN is widely used because it combines strong heat dissipation with dielectric performance, making it attractive for high-power communication and electronic devices.
Silicon Nitride (Si₃N₄)
- High mechanical strength
- Excellent thermal shock resistance
- Used in high-reliability automotive and power modules
4. What Temperatures Can Ceramic PCSs Withstand?
Depending on material and process:
- LTCC ceramic boards: typically operate up to ~850–1000°C processing temperatures
- HTCC ceramic boards: sintered up to ~1300–1600°C
Operating temperatures for finished boards typically far exceed FR-4 limits
Ceramic materials maintain mechanical stability and insulation performance at temperatures where polymer substrates degrade.
5. How Reliable Are Ceramic PCBs In Harsh Environments?
Ceramic PCBs perform extremely well in:
- High temperature environments
- High humidity or corrosive atmospheres
- High vibration conditions
- High voltage insulation requirements
Their inorganic structure prevents moisture absorption and material degradation common in polymer-based boards.
6. How Do I Choose The Right Ceramic PCB Material?
Typical selection guidance:
Application | Recommended Material |
Cost-sensitive industrial electronics | Alumina |
High-power density modules | Aluminum Nitride |
Automotive power or extreme reliability | Silicon Nitride |
7. Can Ceramic PCBs Support Multilayer Designs?
Yes. Technologies such as:
- LTCC (Low Temperature Co-Fired Ceramic)
- HTCC (High Temperature Co-Fired Ceramic)
- DBC (Direct Bonded Copper)
- AMB (Active Metal Brazed)
allow multilayer routing, embedded passives, and high-density interconnects.